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12 Layer ENIG FR4 Makafi Vias PCB

12 Layer ENIG FR4 Makafi Vias PCB

Takaitaccen Bayani:

Layer: 12
Ƙarshen saman: ENIG
Bayanan tushe: FR4
Babban Layer W/S: 7/4mil
Layer na ciki W/S: 5/4mil
Kauri: 1.5mm
Min.rami diamita: 0.25mm


Cikakken Bayani

HDI PCB Material

Abubuwan HDI PCB sune RCC, LDPE, FR4

RCC:Gudun Rufaffen Copper gajere ne don foil ɗin jan ƙarfe mai rufin guduro.RCC yana kunshe da foil na jan karfe da guduro tare da m surface, zafi juriya da kuma anti-oxidation magani (amfani da lokacin da kauri ne fiye da 4mil).The guduro Layer na RCC yana da guda processability kamar FR4 m takardar (prepreg).Bugu da ƙari, ya kamata kuma ya dace da bukatun aikin da ya dace na laminate, kamar:

(1) Babban aminci na rufi da micro via aminci;

(2) Babban zafin canjin gilashin (TG);

(3) Low dielectric akai-akai da ruwa sha;

(4) Yana da babban mannewa da ƙarfi ga foil tagulla;

(5) Bayan warkewa, kaurin rufin rufin ya zama iri ɗaya

A lokaci guda, saboda RCC sabon nau'in samfurin ne ba tare da fiber gilashi ba, yana da amfani ga Laser da Plasma etching magani, kuma yana dacewa da faranti mai sauƙi da bakin ciki.Bugu da kari, burbushin jan karfe mai rufi na resin yana da karfe 12 na dare, karfe 18 na yamma na bakin ciki, mai saukin sarrafawa.

Nunin Kayan aiki

5-PCB kewaye allon atomatik plating line

PCB Layin Plating Na atomatik

PCB kewaye hukumar PTH samar line

Layin PCB PTH

15-PCB kewaye hukumar LDI atomatik Laser scanning line inji

PCB LDI

12-PCB kewaye hukumar CCD daukan hotuna

PCB CCD Exposure Machine

Nunin Masana'antu

Bayanin kamfani

PCB Manufacturing Tushen

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Babban Ofishin


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