8 Layer ENIG FR4 Half Hole PCB
Half Hole Technology
Bayan an yi PCB a cikin rabin rami, an saita Layer Layer a gefen ramin ta hanyar lantarki.Ana amfani da tin Layer a matsayin kariya mai kariya don haɓaka juriya na hawaye da kuma hana kwatancin faɗuwar tagulla daga bangon ramin.Sabili da haka, ƙazanta na ƙazanta a cikin tsarin samar da na'urar da aka buga ya ragu, kuma aikin tsaftacewa yana raguwa, don inganta ingancin PCB da aka gama.
Bayan an gama samar da PCB na rabin rami na al'ada, za a sami guntuwar tagulla a bangarorin biyu na rabin ramin, kuma guntuwar tagulla za su shiga cikin ɓangaren ciki na rabin ramin.Ana amfani da rabin rami lokacin yaro PCB, rawar rabin rami yana cikin aiwatar da PCBA, zai ɗauki rabin ɗan PCB, ta hanyar ba da rabin rami cike da kwano don yin rabin farantin karfen da aka yi wa babban allo. , da rabin rami tare da tagulla na jan karfe, za su shafi tin kai tsaye, yana shafar walda da tabbaci na takardar akan motherboard, kuma yana shafar bayyanar da amfani da duk aikin injin.
A saman ramin rabin ramin an samar da wani karfen karfe, kuma mahadar rabin rami da gefen jiki an ba da shi tare da rata, kuma saman ratar jirgin sama ne ko saman ratar. hade da jirgin sama da saman saman.Ta hanyar haɓaka rata a duka ƙarshen ramin rabin, ana cire guntun jan ƙarfe a mahadar rabin rami da gefen jikin don samar da PCB mai santsi, yadda ya kamata ya guje wa kwakwalwan jan karfe da suka rage a cikin rabin rami, yana tabbatar da ingancin PCB , kazalika da abin dogara waldi da kuma bayyanar ingancin PCB a kan aiwatar da PCBA, da kuma tabbatar da yi na dukan inji bayan m taro.