14 Layer ENIG FR4 Binne Ta PCB
Game da Makafi Binne Ta PCB
Makafi ta hanyar da aka binne ta hanyoyi biyu ne don kafa haɗin gwiwa tsakanin yadudduka na allon da'ira da aka buga.Makafi na allon da'ira da aka buga, tagulla ne da aka yi da tagulla wanda za'a iya haɗa shi zuwa saman saman ta mafi yawan Layer na ciki.Rumbun yana haɗa yadudduka biyu ko fiye na ciki amma baya shiga cikin Layer na waje.Yi amfani da microblind vias don ƙara yawan rarraba layi, haɓaka mitar rediyo da tsangwama na lantarki, sarrafa zafi, shafi sabobin, wayoyin hannu, kyamarorin dijital.
Binne Vias PCB
Vias ɗin da aka binne yana haɗa yadudduka biyu ko fiye na ciki amma baya shiga saman Layer na waje
| Min Hole Diamita/mm | Min zobe/mm | diamita ta-in-pad diamita/mm | Matsakaicin Diamita/mm | Halayen Rabo | |
| Vias Makafi (na al'ada) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Vias Makafi (samfurin na musamman) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Makaho Vias PCB
Makaho Vias shine haɗa Layer na waje zuwa aƙalla Layer na ciki ɗaya
|
| Min.Ramin Diamita/mm | Mafi ƙarancin zobe/mm | diamita ta-in-pad diamita/mm | Matsakaicin Diamita/mm | Halayen Rabo |
| Vias Makafi (na aikin injiniya) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Vias Makafi(Laser hakowa) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Amfanin Vias makafi da binne Vias ga injiniyoyi shine haɓaka yawan abubuwan da ke tattare da shi ba tare da ƙara lamba da girman allon kewayawa ba.Don samfuran lantarki tare da kunkuntar sarari da ƙananan haƙurin ƙira, ƙirar rami makafi shine zaɓi mai kyau.Amfani da irin waɗannan ramukan yana taimaka wa injiniyan ƙirar da'ira don tsara madaidaicin ramuka/pad mai ma'ana don guje wa ƙima mai yawa.
