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14 Layer Makafi An binne Ta PCB

14 Layer Makafi An binne Ta PCB

Takaitaccen Bayani:

Sunan samfur: 14 Layer Blind Buried Via PCB
Layer: 14
Ƙarshen saman: ENIG
Bayanan tushe: FR4
Babban Layer W/S: 4/5mil
Layer na ciki W/S: 4/3.5mil
Kauri: 1.6mm
Min.rami diamita: 0.2mm
Tsari na musamman: Makafi & Binne Vias


Cikakken Bayani

Game da Makafi Binne Ta PCB

Makafi ta hanyar da aka binne ta hanyoyi biyu ne don kafa haɗin gwiwa tsakanin yadudduka na allon da'ira.Makafi na allon da'ira da aka buga, tagulla ne da aka yi da tagulla wanda za'a iya haɗa shi da Layer na waje ta mafi yawan Layer na ciki.Rumbun yana haɗa yadudduka biyu ko fiye na ciki amma baya ratsa Layer na waje.Yi amfani da microblind vias don ƙara yawan rarraba layi, haɓaka mitar rediyo da tsangwama na lantarki, tafiyar da zafi, shafi sabobin, wayoyin hannu, kyamarori dijital.

Binne Vias PCB

Vias ɗin da aka binne yana haɗa yadudduka biyu ko fiye na ciki amma baya shiga saman Layer na waje

 

Min Hole Diamita/mm

Min zobe/mm

diamita ta-in-pad diamita/mm

Matsakaicin Diamita/mm

Halayen Rabo

Vias Makafi (na al'ada)

0.1

0.1

0.3

0.4

1:10

Vias Makafi (samfurin na musamman)

0.075

0.075

0.225

0.4

1:12

Makafi Vias PCB

Makaho Vias shine haɗa Layer na waje zuwa aƙalla Layer na ciki ɗaya

 

Min.Ramin Diamita/mm

Mafi ƙarancin zobe/mm

diamita ta-in-pad diamita/mm

Matsakaicin Diamita/mm

Halayen Rabo

Vias Makafi (na aikin injiniya)

0.1

0.1

0.3

0.4

1:10

Vias Makafi(Laser hakowa)

0.075

0.075

0.225

0.4

1:12

Amfanin Vias makafi da kuma binne Vias ga injiniyoyi shine haɓaka yawan abubuwan da ke tattare da shi ba tare da ƙara adadin Layer da girman allon kewayawa ba.Don samfuran lantarki tare da kunkuntar sarari da ƙananan haƙurin ƙira, ƙirar rami makafi shine zaɓi mai kyau.Yin amfani da irin waɗannan ramukan yana taimaka wa injiniyan ƙirar da'ira don tsara madaidaicin rami/pad mai ma'ana don guje wa ƙima mai yawa.


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