10 Layer ENIG FR4 Makafi Vias PCB
Game da Makafi Binne Ta PCB
Makaho Ta:wanda ke ba da damar haɗi da gudanarwa tsakanin yadudduka na ciki da na waje
An binne Ta:wanda zai iya haɗawa da jagora tsakanin yadudduka na ciki Makafi Vias galibi ƙananan ramuka ne tare da diamita na 0.05mm ~ 0.15mm.Akwai ramin Laser da ke ƙera, rami mai ƙyalƙyali na plasma da rami mai ɗaukar hoto, kuma ana amfani da ramin laser.
HDI:Haɗin haɗin kai mai girma, hakowa mara injina, zoben rami-makafi da ke ƙasa da 6mil, ciki da waje yadudduka na layin waya nisa / ratar layin yana ƙasa da 4mil, diamita na kushin bai fi 0.35mm ana kiran yanayin samarwa na HDI ba. .
Vias Makafi
Ana amfani da Vias makafi don haɗa Layer waje ɗaya zuwa aƙalla Layer na ciki ɗaya.Kowane rami na makafi yana buƙatar samar da fayil ɗin rawar soja daban.Matsakaicin zurfin rami zuwa buɗaɗɗen (rabo rabe / kauri-diamita rabo) dole ne ya zama ƙasa da ko daidai da 1. Maɓallin maɓalli yana ƙayyade zurfin rami, wato, matsakaicin nisa tsakanin babban Layer da Layer na ciki.
Nunin Kayan aiki
PCB Layin Plating Na atomatik
Layin PCB PTH
PCB LDI
PCB CCD Exposure Machine
Nunin Masana'antu
PCB Manufacturing Tushen
Admin Receptionist
Dakin Taro
