4 Layer ENIG FR4 Binne Ta PCB
Game da HDI PCB
Saboda tasirin kayan aikin hakowa, farashin hakowa na PCB na gargajiya yana da yawa sosai lokacin da diamita hakowa ya kai 0.15mm, kuma yana da wahala a sake ingantawa.Hakowa na hukumar HDI PCB baya dogara da hakowa na inji na gargajiya, amma yana amfani da fasahar hakowa ta Laser.(don haka wani lokaci ana kiransa farantin Laser.) Diamita na rami na HDI PCB shine gabaɗaya 3-5mil (0.076-0.127mm), kuma faɗin layin gabaɗaya 3-4mil (0.076-0.10mm).Ana iya rage girman kushin sosai, don haka ana iya samun ƙarin rarraba layi a yanki naúrar, yana haifar da haɗin kai mai yawa.
Fitowar fasahar HDI ta dace da kuma haɓaka ci gaban masana'antar PCB.Don haka ana iya shirya ƙarin BGA da QFP masu yawa a cikin allon PCB HDI.A halin yanzu, an yi amfani da fasaha na HDI sosai, wanda aka yi amfani da shi na farko na HDI a cikin samar da 0.5 pitch BGA PCB.
Haɓaka fasahar HDI tana haɓaka haɓaka fasahar guntu, wanda hakan ke haɓaka haɓakawa da ci gaban fasahar HDI.
A halin yanzu, injiniyoyin ƙira suna amfani da guntu BGA na 0.5pitch, kuma kusurwar siyar da BGA ta canza sannu a hankali daga nau'in rami na tsakiya ko ƙasa ta tsakiya zuwa nau'in shigar da siginar cibiyar da fitarwa mai buƙatar wayoyi.
Fa'idodin Makaho Ta Hanyar Kuma Binne Ta PCB
Aikace-aikacen makafi da aka binne ta hanyar PCB na iya rage girman girman da ingancin PCB, rage yawan yadudduka, haɓaka ƙarfin lantarki na lantarki, haɓaka fasalin samfuran lantarki, rage farashi, da sanya aikin ƙira ya fi dacewa da sauri.A cikin ƙirar PCB na gargajiya da machining, ta hanyar rami zai kawo matsaloli da yawa.Da farko, sun mamaye babban adadin tasiri mai tasiri.Na biyu, babban adadin ta ramuka a wuri guda kuma yana haifar da babbar cikas ga tafiyar da layin ciki na PCB Multi-Layer.Waɗannan ta ramuka suna mamaye sararin da ake buƙata don tuƙi.Kuma aikin hakowa na inji na al'ada zai kasance sau 20 fiye da fasahar da ba ta lalata ba.