8 Layer ENIG Impedance Control PCB Copper Copper
Bakin Karɓar Core Heavy Copper PCB Copper Foil Choice
Matsalar da ta fi damuwa da nauyin jan karfe CCL PCB shine matsalar juriya na matsa lamba, musamman ma bakin ciki core nauyi PCB (bakin ciki core matsakaicin kauri ≤ 0.3mm), matsalar juriya ce ta musamman, bakin ciki mai nauyi mai nauyi PCB zai zabi RTF gabaɗaya. jan karfe don samarwa, RTF jan karfe da STD jan karfe babban bambanci shine tsayin ulu Ra ya bambanta, RTF jan karfe Ra yana da mahimmanci ƙasa da STD jan karfe.
Tsarin ulu na bangon jan karfe yana rinjayar kauri na rufin rufin substrate.Tare da ƙayyadaddun ƙayyadaddun kauri iri ɗaya, RTF jan karfe foil Ra ƙarami ne, kuma ingantaccen rufin rufin dielectric ya fi kauri a fili.Ta hanyar rage digiri na ulu, za a iya inganta juriya mai nauyi na jan ƙarfe na bakin ciki da kyau.
PCB CCL mai nauyi da Prepreg
Haɓakawa da haɓaka kayan aikin HTC: jan ƙarfe ba wai kawai yana da kyakkyawan tsari da ƙa'idar aiki ba, amma har ma yana da kyawawan halayen thermal.Yin amfani da PCB mai nauyi na jan karfe da aikace-aikacen matsakaici na HTC yana zama a hankali ya zama jagorar masu zanen kaya don magance matsalar zafi.Yin amfani da HTC PCB tare da zane mai nauyin jan karfe ya fi dacewa ga dumbin zafi na kayan lantarki, kuma yana da fa'ida a bayyane a farashi da tsari.