Ta Tsari a Multilayer PCB Fabrication

Vias suna daya daga cikin mahimman abubuwan da ke cikimultilayer PCB ƙirƙira, kuma farashin hakowa yawanci yana ɗaukar kashi 30% zuwa 40% na farashinPCB samfur.Ramin ta ramin shine ramin da aka haƙo a kan lamintin tagulla.Yana ɗaukar gudanarwa tsakanin yadudduka kuma ana amfani dashi don haɗin lantarki da gyara na'urori.zobe.

Daga tsarin ƙirƙira na PCB multilayer, vias sun kasu kashi uku, wato, ramuka, ramukan binne kuma ta ramuka.A multilayer PCB ƙirƙira da kuma samar, kowa via matakai sun hada da via murfin man fetur, via toshe mai, via taga bude, guduro toshe rami, electroplating rami cika, da dai sauransu Kowane tsari yana da nasa halaye.

1. Via murfin mai

The "man" na via cover man yana nufin solder mask man, da kuma via rami cover man ne ya rufe ramin zobe na via rami da solder mask tawada.Manufar ta hanyar man murfin shine don rufewa, don haka ya zama dole don tabbatar da cewa murfin tawada na zoben ramin ya cika kuma ya isa sosai, don kada tin ya manne wa facin da DIP daga baya.Ya kamata a lura a nan cewa idan fayil ɗin PADS ne ko Protel, lokacin da aka aika shi zuwa masana'antar kera PCB multilayer don ta hanyar mai, dole ne ku bincika a hankali ko ramin toshe (PAD) yana amfani da ita, kuma idan haka ne, ku toshe rami za a rufe da kore mai kuma ba za a iya walda.

2. Ta taga

Akwai wata hanyar da za a magance "ta hanyar mai rufewa" lokacin da aka buɗe ta rami.Kada a rufe ta rami da gromet da man abin rufe fuska mai solder.Budewar ta hanyar rami zai kara yawan zafin jiki na zafi, wanda zai iya haifar da zafi.Sabili da haka, idan buƙatun ɓarkewar zafi na jirgi suna da tsayi sosai, ana iya zaɓar buɗewar ta hanyar rami.Bugu da ƙari, idan kuna buƙatar amfani da multimeter don yin wasu aikin aunawa akan vias yayin ƙirƙira PCB multilayer, to sai ku buɗe ta hanyar.Duk da haka, akwai haɗarin buɗewa ta hanyar rami - yana da sauƙi don sa kushin ya gajarta zuwa tin.

3. Ta hanyar toshe mai

Ta hanyar toshe mai, wato, lokacin da ake sarrafa PCB multilayer, kuma ana samar da tawada, ana fara shigar da tawada mai solder a cikin rami tare da takardar aluminium, sannan a buga man abin rufe fuska a kan dukkan allo, da duk ta ramuka. ba zai watsa haske ba.Manufar ita ce a toshe mashin ɗin don hana ƙullun kwano su ɓoye a cikin ramukan, domin ƙullun kwano za su gudana zuwa ga pads idan an narkar da su da zafi mai zafi, yana haifar da gajeren kewayawa, musamman a kan BGA.Idan vias ba su da tawada mai kyau, gefuna na ramukan za su juya ja, haifar da "bayyanar jan karfe na karya" mara kyau.Bugu da ƙari, idan ba a yi amfani da mai ta hanyar rami mai kyau ba, zai kuma shafi bayyanar.

4. Resin toshe rami

Ramin toshe guduro kawai yana nufin cewa bayan bangon ramin yana da jan ƙarfe, ramin yana cike da resin epoxy, sannan kuma ana liƙa tagulla a saman.Tushen ramin toshe guduro shine cewa dole ne a sami platin jan karfe a cikin ramin.Wannan saboda ana yawan amfani da ramukan toshe guduro a cikin PCBs don sassan BGA.BGA na gargajiya na iya amfani da ita tsakanin PAD da PAD don tura wayoyi zuwa baya.Koyaya, idan BGA yayi yawa kuma Via ba zai iya fita ba, ana iya hako shi kai tsaye daga PAD.Yi Ta hanyar zuwa wani bene don hanyar igiyoyi.Filayen ƙirƙira na PCB da yawa ta hanyar tsarin rami na toshe guduro ba shi da ƙoshin lafiya, kuma ana iya kunna ramukan ba tare da cutar da siyar ba.Saboda haka, an fi so a kan wasu samfurori tare da manyan yadudduka daalluna masu kauri.

5. Electroplating da rami cika

Electroplating da ciko yana nufin cewa vias suna cike da electroplated jan karfe a lokacin multilayer PCB masana'anta, kuma kasan ramin ne lebur, wanda ba kawai dace da zane na stacked ramukan da kuma.via a pads, amma kuma yana taimakawa wajen inganta aikin lantarki, zafi mai zafi, da kuma dogara.