Ta hanyar-rami zane a high gudun PCB

Ta hanyar-rami zane a high gudun PCB

A cikin ƙirar PCB mai sauri, ramin da alama sauƙaƙa sau da yawa yana kawo mummunan sakamako ga ƙirar kewaye.Ta hanyar rami (VIA) yana ɗaya daga cikin mahimman abubuwan haɗin gwiwaallunan PCB multilayer, kuma farashin hakowa yawanci yana ɗaukar kashi 30% zuwa 40% na farashin hukumar PCB.A taƙaice, kowane rami a cikin PCB ana iya kiransa ta rami.

Daga ra'ayi na aiki, ana iya raba ramuka zuwa nau'i biyu: ana amfani da ɗaya don haɗin wutar lantarki tsakanin yadudduka, ɗayan kuma ana amfani dashi don gyaran na'urar ko matsayi.Dangane da tsarin fasaha, gabaɗaya waɗannan ramukan sun kasu kashi uku, wato makafi ta hanyar, kyandir ta hanyar.

Don rage mummunan tasirin da tasirin parasitic na pore ya haifar, ana iya yin abubuwa masu zuwa kamar yadda zai yiwu a cikin zane:

Yin la'akari da farashi da ingancin sigina, an zaɓi rami mai ma'ana.Misali, don ƙirar 6-10 Layer ƙwaƙwalwar ajiya na ƙirar PCB, yana da kyau a zaɓi rami 10/20mil (rami/pad).Don wasu ƙananan ƙananan ƙananan girman, za ku iya gwada amfani da rami na 8/18mil.Tare da fasaha na yanzu, yana da wuya a yi amfani da ƙananan perforations.Don samar da wutar lantarki ko ramin waya na ƙasa ana iya la'akari da yin amfani da girman girman girma, don rage rashin ƙarfi.

Daga cikin dabaru guda biyu da aka tattauna a sama, ana iya ƙarasa da cewa yin amfani da allon PCB mai ƙaranci yana da fa'ida don rage sigogin parasitic guda biyu na pore.

Ya kamata a hako fitilun wutar lantarki da ƙasa a kusa.Gajerun hanyoyin da ke tsakanin fil da ramuka, mafi kyau, kamar yadda za su haifar da karuwa a cikin inductance.A lokaci guda, samar da wutar lantarki da jagorancin ƙasa ya kamata su kasance mai kauri kamar yadda zai yiwu don rage rashin ƙarfi.

Sigina wayoyi a kanallon PCB mai saurikada ya canza yadudduka gwargwadon yiwuwa, wato, don rage ramukan da ba dole ba.

Ana sanya wasu ramukan ƙasa kusa da ramukan da ke cikin siginar musayar siginar don samar da madaidaicin madauki don siginar.Za ka iya har ma da yawa ƙarin ramukan ƙasa a kanPCB allon.Tabbas, kuna buƙatar zama masu sassauƙa a cikin ƙirar ku.Samfurin ramuka da aka tattauna a sama yana da pads a kowane Layer.Wani lokaci, muna iya rage ko ma cire pads a wasu yadudduka.

Musamman ma a yanayin girman girman pore, yana iya haifar da samuwar tsagi mai karye a cikin shimfidar jan karfe na da'ira.Don magance wannan matsala, ban da motsi matsayi na pore, za mu iya la'akari da rage girman kushin solder a cikin tagulla Layer.

Yadda ake amfani da ramuka: Ta hanyar binciken da ke sama na halayen parasitic na kan ramuka, zamu iya ganin hakan a cikiPCB mai sauriƙira, da alama mai sauƙin amfani mara kyau na sama da ramuka sau da yawa zai kawo mummunan sakamako ga ƙirar kewaye.