Babban Material Don Samar da PCB

Babban Kayayyakin Don Samar da PCB

A zamanin yau, akwai da yawa PCB masana'antun, farashin ba high ko low, inganci da sauran matsalolin da muka sani ba game da, yadda za a zabi.PCB masana'antukayan?Kayan sarrafawa, gabaɗaya farantin ƙarfe na jan karfe, busasshen fim, tawada, da sauransu, waɗannan abubuwa da yawa don taƙaitaccen gabatarwa.

1. Tufafin Copper

Wanda ake kira farantin tufar tagulla mai gefe biyu.Ko za'a iya rufe foil ɗin tagulla a kan abin da ake ɗaure ya ƙaddara, kuma ƙarfin tsirwar farantin tagulla ya dogara ne akan aikin mai ɗaure.Kauri farantin jan karfe da aka saba amfani da shi na 1.0 mm, 1.5 mm da 2.0 mm uku.

(1) nau'ikan faranti masu suturar tagulla.

Akwai hanyoyin rarrabuwa da yawa don faranti masu suturar tagulla.Kullum bisa ga farantin ƙarfafa kayan ya bambanta, za a iya raba zuwa: takarda tushe, gilashin fiber zane tushe, hadawa tushe (CEM jerin), Multi-Layer farantin tushe da kuma musamman kayan tushe ( yumbu, karfe core tushe, da dai sauransu) biyar. sassa.Bisa ga daban-daban guduro adhesives amfani da hukumar, na kowa takarda tushen CCL su ne: phenolic guduro (XPC, XXXPC, FR-L, FR-2, da dai sauransu.), epoxy guduro (FE-3), polyester guduro da sauran iri. .Gilashin fiber na yau da kullun CCL yana da guduro epoxy (FR-4, FR-5), a halin yanzu shine nau'in fiber na gilashin da aka fi amfani dashi.Sauran na musamman guduro (tare da gilashin fiber zane, nailan, wadanda ba saka, da dai sauransu don ƙara kayan): biyu maleic imide modified triazine guduro (BT), polyimide (PI) guduro, diphenylene manufa guduro (PPO), maleic acid wajibi imine - styrene guduro (MS), poly (oxygen acid ester guduro, polyene saka a cikin guduro, da dai sauransu. Bisa ga harshen retardant Properties na CCL, shi za a iya raba zuwa harshen wuta retardant da kuma wadanda ba harshen retardant faranti. A cikin 'yan shekaru daya zuwa biyu. tare da ƙarin kulawa ga kariyar muhalli, an samar da sabon nau'in CCL ba tare da kayan hamada ba a cikin CCL mai saurin wuta, wanda za'a iya kiransa "CCL mai kare harshen wuta". , daga aikin rarrabuwa na CCL, ana iya raba shi zuwa babban aikin CCL, ƙarancin dielectric akai-akai, CCL mai zafi mai ƙarfi, ƙarancin haɓaka ƙimar thermal CCL (wanda aka saba amfani dashi don marufi substrate) da sauran nau'ikan.

(2)alamun nuna aikin farantin karfe.

Gilashin canjin yanayi.Lokacin da zafin jiki ya tashi zuwa wani yanki, substrate zai canza daga "jihar gilashi" zuwa "jihar roba", ana kiran wannan zafin jiki da zafin jiki na gilashin (TG) na farantin.Wato, TG shine mafi girman zafin jiki (%) wanda substrate ya kasance mai ƙarfi.Wato, talakawa substrate kayan a high zafin jiki, ba kawai samar softening, nakasawa, narkewa da sauran al'amura, amma kuma nuna wani kaifi ƙi a inji da lantarki halaye.

Gabaɗaya, TG na allon PCB yana sama da 130 ℃, TG na babban allon yana sama da 170 ℃, kuma TG na allon matsakaici yana sama da 150 ℃.Yawanci darajar TG na allon bugawa 170, wanda ake kira babban allon buga TG.An inganta TG na substrate, kuma za a inganta juriya na zafi, juriya na danshi, juriya na sinadarai, kwanciyar hankali da sauran halaye na allon buga.Mafi girman ƙimar TG, mafi kyawun juriya na zafin jiki na farantin, musamman a cikin tsarin da ba shi da gubar,Babban darajar PCBan fi amfani da shi sosai.

2. Dielectric akai-akai.

Tare da haɓaka fasahar lantarki cikin sauri, saurin sarrafa bayanai da watsa bayanai yana haɓaka.Don fadada tashar sadarwa, ana amfani da mitar amfani zuwa babban filin mitar, wanda ke buƙatar kayan da ake buƙata don samun ƙananan dielectric akai-akai E da ƙananan asarar dielectric TG.Ta hanyar rage E kawai za'a iya samun saurin watsa sigina mai girma, kuma ta rage TG kawai za'a iya rage asarar watsa siginar.

3. Thermal fadada coefficient.

Tare da haɓaka daidaitattun daidaito da multilayer na allon buga da BGA, CSP da sauran fasaha, masana'antun PCB sun gabatar da buƙatu mafi girma don kwanciyar hankali na girman farantin karfe.Kodayake daidaiton girman farantin tagulla yana da alaƙa da tsarin samarwa, galibi ya dogara da albarkatun ƙasa guda uku na farantin tagulla: guduro, kayan ƙarfafawa da foil na jan karfe.Hanyar da aka saba ita ce a gyaggyara guduro, kamar gyaggyarawa resin epoxy;Rage rabon abun ciki na guduro, amma wannan zai rage rufin lantarki da kaddarorin sinadarai na substrate;Rufin tagulla ba shi da ɗan tasiri akan daidaiton girman farantin jan karfe. 

4.Ayyukan toshe UV.

A cikin aiwatar da kera allon da'ira, tare da yaɗawar solder mai ɗaukar hoto, don guje wa inuwa biyu da ke haifar da tasirin juna a ɓangarorin biyu, dole ne duk abubuwan da ake amfani da su suna da aikin garkuwar UV.Akwai hanyoyi da yawa don toshe watsa hasken ultraviolet.Gabaɗaya, ana iya gyaggyara nau'ikan zane ɗaya ko biyu na gilashin fiber fiber da resin epoxy, kamar amfani da guduro epoxy tare da UV-block da aikin ganowa ta atomatik.

Huihe Circuits ƙwararriyar masana'anta ce ta PCB, kowane tsari ana gwada shi sosai.Daga allon da'irar don yin tsari na farko zuwa na ƙarshe na duba ingancin tsari, Layer kan Layer yana buƙatar bincika sosai.Zaɓin alluna, tawada da aka yi amfani da su, kayan aikin da aka yi amfani da su, da tsangwama na ma'aikata na iya shafar ingancin hukumar ta ƙarshe.Tun daga farko har zuwa ingancin dubawa, muna da ƙwararrun kulawa don tabbatar da cewa an kammala kowane tsari bisa ga al'ada.Ku biyo mu!