8 Layer ENIG FR4 Via-In-Pad PCB
Abu mafi wahala don sarrafa ramin filogi a cikin ta-in-pad shine ƙwallon solder ko pad akan tawada a cikin ramin.Saboda wajibcin amfani da babban yawa BGA (tsarin grid na ball) da ƙaramin guntu na SMD, aikace-aikacen fasahar rami na tire yana ƙaruwa.Ta hanyar abin dogaro ta hanyar aiwatar da ramuka, ana iya amfani da fasahar rami a cikin faranti don ƙira da kera babban allon multilayer, da kuma guje wa walƙiya mara kyau.HUIHE Circuits yana amfani da fasahar ta-in-pad tsawon shekaru da yawa, kuma yana da ingantaccen tsarin samar da ingantaccen abin dogaro.
Ma'auni Na Via-In-Pad PCB
| Kayayyakin al'ada | Samfura na musamman | Samfura na musamman | |
| Matsayin cika rami | IPC 4761 Nau'in VII | IPC 4761 Nau'in VII | - |
| Min Hole Diamita | 200µm | 150µm | 100µm |
| Girman kushin mafi ƙarancin | 400µm | 350µm | 300µm |
| Max Hole Diamita | 500µm | 400µm | - |
| Matsakaicin girman kushin | 700µm | 600µm | - |
| Mafi ƙarancin farantin fil | 600µm | 550m ku | 500µm |
| Rabo Halaye: Na al'ada ta hanyar | 1:12 | 1:12 | 1:10 |
| Rabo Halaye: Makafi ta hanyar | 1:1 | 1:1 | 1:1 |
Ayyukan Plug Hole
1.Hana tin daga wucewa ta hanyar rami mai sarrafawa ta hanyar ɓangaren ɓangaren yayin sayar da igiya
2.A guji saura ruwa a cikin rami
3.Hana ƙwallayen kwano daga fitowa a lokacin sayar da igiyar ruwa, yana haifar da gajeriyar kewayawa
4.Prevent surface solder manna daga gudãna a cikin rami, haifar kama-da-wane waldi da kuma shafi dacewa.
Amfanin Via-In-Pad PCB
1.Inganta zafin zafi
2.An inganta ƙarfin ƙarfin ƙarfin lantarki na vias
3.Samar da lebur da daidaito
4.Lower parasitic inductance
Amfaninmu
1. Ma'aikata na mallaka, yanki na masana'anta 12000 murabba'in mita, tallace-tallace kai tsaye na masana'anta
2. Ƙungiyar tallace-tallace ta samar da sauri da inganci kafin tallace-tallace da sabis na tallace-tallace
3.Process-tushen aiki na PCB zane bayanai don tabbatar da cewa abokan ciniki iya duba da kuma tabbatar a farkon lokaci
