6 Layer ENIG FR4 Via-In-Pad PCB
Ayyukan Plug Hole
The toshe rami shirin na buga kewaye da'ira (PCB) tsari ne da aka samar da mafi girma bukatun na PCB masana'antu tsari da surface Dutsen fasaha:
1.Avoid short circuit lalacewa ta hanyar tin shiga ta cikin bangaren surface daga ta rami a lokacin PCB kan igiyar ruwa soldering.
2.A guji yin saura a cikin rami.
3.Trevent solder bead daga popping fita a lokacin da igiyar ruwa soldering, haifar da gajeren kewaye.
4.Trevent da surface solder manna daga gudãna a cikin rami, haifar da ƙarya soldering da kuma rinjayar da hawa.
Via In pad Process
Ƙayyade
Domin ramukan wasu ƙananan sassa da za a welded a kan PCB na yau da kullun, hanyar samar da al'ada ita ce a tono rami a kan allo, sannan a sanya wani Layer na jan karfe a cikin ramin don gane abin da ke tsakanin yadudduka, sa'an nan kuma jagoranci waya. don haɗa kushin walda don kammala walda tare da sassan waje.
Ci gaba
Ana haɓaka tsarin kera ta Via in Pad a kan bangon bangon allon da'irar da ke da alaƙa da haɗin kai, inda babu sauran ɗaki don wayoyi da pads waɗanda ke haɗa ta cikin ramuka.
Fuction
Tsarin samarwa na VIA IN PAD yana sa tsarin samar da PCB ya zama nau'i uku, yadda ya kamata ya ceci sararin samaniya, da ADAPTS zuwa yanayin ci gaba na hukumar da'ira ta zamani tare da babban yawa da haɗin kai.