6 Layer ENIG Via-In-Pad PCB

1. Ramin toshe na iya hana PCB ta hanyar siyar da tin na igiyar ruwa daga ramin ramin ta hanyar ɓangaren abubuwan da ke haifar da gajeriyar kewayawa;Wato, a cikin iyakokin yankin ƙirar igiyar igiyar ruwa (yawanci saman walda shine 5mm ko sama) babu rami ko rami don yin maganin toshe rami.

2. Ramin filogi yana ba da kariya daga yiwuwar gajerun da'irori da ke haifar da na'urori masu nisa kamar BGA.Wannan shine dalilin rami a ƙarƙashin BGA don kiyaye rami a cikin tsarin ƙira.Domin babu ramin filogi, wannan lamari ne na gajeriyar kewayawa.

3. Kauce wa ragowar juzu'i a cikin rami mai sarrafawa;

4. Bayan da surface hawa da bangaren taro na Electronics factory da aka kammala, da PCB za a vacuum tunawa da korau matsa lamba kafa a kan gwajin inji kafin kammala:

5. Hana manne solder surface a cikin rami lalacewa ta hanyar kama-da-wane waldi, shafi shigarwa;Wannan batu ya fi bayyana a cikin kushin zubar da zafi tare da ramuka.

6. Don hana raƙuman sayar da tin beads suna tashi, yana haifar da ɗan gajeren kewayawa.

7. Ramin toshe zai zama taimako ga tsarin SMT.