4 Layer ENIG FR4 Half Hole PCB

Hakowa -- Chemical Copper -- Cikakken Farantin ƙarfe -- Canja wurin Hoto -- Graphics Electroplating -- Defilm -- Etching -- Stretch Soldering -- Rufin saman Ramin Ramin (wanda aka siffa a lokaci ɗaya tare da bayanin martaba).

An yanke rabin ramin da aka yi da karfe da rabi bayan an kafa ramin zagaye.Yana da sauƙi a bayyana abin da ya faru na ragowar waya na jan karfe da jakin fata na jan karfe a cikin rabin rami, wanda ke shafar aikin rabi na rabi kuma yana haifar da raguwar aikin samfurin da yawan amfanin ƙasa.Domin shawo kan sama lahani, shi za a za'ayi bisa ga wadannan matakai matakai na metallized Semi-orifice PCB:

1. Sarrafa rabin rami biyu wuka nau'in V.

2. A cikin rawar jiki na biyu, an ƙara ramin jagora a gefen ramin, an cire fata na jan karfe a gaba, kuma an rage burr.Ana amfani da tsagi don hakowa don haɓaka saurin faɗuwa.

3. Copper plating a kan substrate, don haka da cewa wani Layer na jan karfe plating a kan ramin bango na zagaye rami a gefen farantin.

4. Ana yin da'irar waje ta hanyar fim ɗin matsawa, haɓakawa da haɓakar substrate bi da bi, sa'an nan kuma an sanya substrate tare da jan karfe da kwano sau biyu, don haka Layer na jan karfe akan bangon rami na rami zagaye a gefen gefen. farantin yana da kauri kuma an rufe murfin tagulla da tin Layer tare da tasirin lalata;

5. Rabin ramin kafa farantin gefen ramin zagaye da aka yanke a rabi don samar da ramin rabi;

6. Cire fim ɗin zai cire fim ɗin anti-plating da aka danna a cikin aikin danna fim;

7. Etch da substrate, da kuma cire fallasa tagulla etching a kan m Layer na substrate bayan cire fim;Tin peeling The substrate ne bawo don cire tin daga Semi-perforated bango da jan karfe Layer a kan Semi-. bango mai ratsa jiki yana fallasa.

8. Bayan yin gyare-gyare, yi amfani da tef ɗin ja don haɗa faranti tare, kuma a kan layin etching na alkaline don cire burrs.

9. Bayan na biyu na jan karfe da kuma tin plating a kan substrate, ramin madauwari a gefen farantin an yanke shi cikin rabi don samar da ramin rabi.Domin katangar tagulla na bangon ramin an lulluɓe shi da tin Layer, kuma tagulla na bangon ramin yana da alaƙa gabaɗaya tare da Layer na tagulla na saman Layer na waje, kuma ƙarfin ɗaure yana da girma, layin tagulla akan ramin. Za a iya guje wa bango yadda ya kamata lokacin yanke, kamar cirewa ko abin da ya faru na warping na jan karfe;

10. Bayan kammala Semi-rami kafa sa'an nan cire fim, sa'an nan kuma etch, jan karfe surface hadawan abu da iskar shaka ba zai faru, yadda ya kamata kauce wa faruwa na jan karfe saura har ma da gajeren kewaye sabon abu, inganta yawan amfanin ƙasa na metallized Semi-rami PCB. .