12 Layer ENIG PCB
HDI PCB Material
Abubuwan HDI PCB sune RCC, LDPE, FR4
RCC:Gudun Rufaffen Copper gajere ne don foil ɗin jan ƙarfe mai rufin guduro.RCC yana kunshe da foil na jan karfe da guduro tare da m surface, zafi juriya da kuma anti-oxidation magani (amfani da lokacin da kauri ne fiye da 4mil).The guduro Layer na RCC yana da guda processability kamar yadda FR4 m takardar (prepreg).Bugu da ƙari, ya kamata kuma ya dace da abubuwan da suka dace na aikin laminate, kamar:
(1) Babban aminci na rufi da micro via aminci;
(2) Babban zafin canjin gilashin (TG);
(3) Low dielectric akai-akai da ruwa sha;
(4) Yana da babban mannewa da ƙarfi ga foil tagulla;
(5) Bayan warkewa, kaurin rufin rufin ya zama iri ɗaya
A lokaci guda kuma, saboda RCC sabon nau'in samfurin ne ba tare da fiber gilashi ba, yana da amfani ga Laser da Plasma etching magani, kuma yana dacewa da faranti mai sauƙi da bakin ciki.Bugu da kari, burbushin jan karfe mai rufi na resin yana da karfe 12 na dare, karfe 18 na yamma na bakin ciki, mai saukin sarrafawa.
Nunin Kayan aiki
PCB Layin Plating Na atomatik
Layin PCB PTH
PCB LDI
PCB CCD Exposure Machine
Nunin Masana'antu
PCB Manufacturing Tushen
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